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15:40 - 16:10
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Paper No. 2015-SAT-S0206-I001
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Invited Speaker:
Marc P. De Micheli
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Fabrication and characterization of Nonlinear Proton Exchanged Integrated Optics Circuits in LiNbO3 and their potential
This paper presents the fabrication of integrated optical circuits in LiNbO3 and PPLN using different proton exchange processes. Using a complete set of material and optical characterizations, the impact of these different processes on the crystal properties is described and their potential to realize compact and efficient devices is discussed.
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16:10 - 16:25
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Paper No. 2015-SAT-S0206-O001
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| Zhu Qing-Song
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Sub-wavelength grating structure on the planar waveguide
In this study，laser interference lithography is
used to make sub-wavelength gratings on the planar
waveguide which is a coupling device on the glass substrate.
The purpose is to reduce the device size and enhance coupling
efficiency. We designed and developed the device using the
Finite-Difference Time-Domain method. The grating period,
depth, fill factor, film thickness and different grating structure
have been discussed to enhance coupling efficiency and
reduced coupling angle. According to the simulation results,
when the wavelength is 532 nm, the grating period is 300 nm
and the Ta2O5 film is 100 nm which had the optimum coupling
efficiency and minimum coupling angle.
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16:25 - 16:40
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Paper No. 2015-SAT-S0206-O002
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| Hung-Ching Chung
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Robust Polymer Waveguide Beam Splitter Using Shortcuts to Adiabaticity
A robust polymer waveguide beam splitter designed by shortcuts to adiabaticity is introduced. The design of beam splitter is achieved by combining shortcuts to adiabaticity and perturbation theory. The error sensitivity of the coupler is minimized by optimizing the evolution with respect to split ratio variations.
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16:40 - 16:55
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Paper No. 2015-SAT-S0206-O003
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| Tai-Jyun Yu
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Three-dimensional Optical Path on Silicon Optical Bench with Cantilever Waveguide Sensing Element
In this paper, a three-dimensional optical path on silicon optical bench (SiOB) with cantilever waveguide sensing element is proposed for the first time to overcome the bottleneck of laser and PD integration. In the proposed approach, the three-dimensional optical path consists of input 45-degree micro reflector, cantilever waveguide, and output 45-degree micro reflector. A vertical-cavity-surface-emitted-laser (VCSEL) and a PD could be easily integrated into SiOB by three-dimensional optical path.
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16:55 - 17:10
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Paper No. 2015-SAT-S0206-O004
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| Wang Sin-Kai
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Low-Temperature Direct Wafer Bonding for III–V Semiconductors to Si Wafers
In this paper, the direct wafer bonding with different temperatures are designed and fabricated. By oxygen plasma-enhanced process, we successfully present the results of a low-temperature process for direct bonding of InP epitaxial layers on a silicon wafer. In addition, the best bonding condition can be found by the magnitude of die shear and the photoluminescence spectra were characterized.
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